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Intel® SSD 530 Series
SSDSCKGW180A4 (180GB, M.2 80mm SATA 6Gb/s, 20nm, MLC)
SSDMCEAW240A4 (240GB, PCIe Module mSATA 6Gb/s, 20nm, MLC)
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PART NUMBER |
Photo |
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SSDSCKGW180A4 |
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Capacity
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Sequential Read/Write (up to)1 |
Random 4KB Read/Write (up to)2 |
Form Factor |
| 180GB |
6Gb/s 540 MB/s / 490 MB/s |
41,000 IOPS / 80,000 IOPS |
M.2 (80mm) |
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Intel® Solid-State Drive 530 Series (M.2)
Product Specification |
- Capacities: 180 GB
- Components:
− Intel® 20 nm NAND Flash Memory
− Multi-Level Cell (MLC)
- Form Factors: M.2 80 mm (single- and double-sided)
− 2280-S2-B-M (80 GB and 180 GB)
− 2280-D2-B-M (120 GB and 360 GB)
- Thickness: up to 3.58 mm
- Weight: < 10 grams
- SATA 6 Gb/s Bandwidth Performance1
(Iometer* Queue Depth 32)
− Sustained Sequential Read: up to 540 MB/s
− Sustained Sequential Write: up to 490 MB/s
- Read and Write IOPS1
(Iometer Queue Depth 32)
− Random 4 KB Reads: up to 41,000 IOPS
− Random 4 KB Writes: up to 80,000 IOPS2
- Data Compression
- AES 256-bit Encryption
- End-to-End Data Protection
- Compatibility
− Intel® SSD Toolbox with Intel® SSD Optimizer
− Intel® Data Migration Software
− Intel® Rapid Storage Technology
− SATA Revision 3.0
− ACS-2 (ATA/ATAPI Command Set 2)
− SSD Enhanced SMART ATA feature set
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- Power Management
− 3.3 V SATA Supply Rail
− SATA Link Power Management (LPM)
− Device Sleep (DevSleep)
- Power
− Active (BAPCo MobileMark* 2007 Workload): 140 mW
− Idle3: 55 mW
− DevSleep: 200 μW
- Temperature
− Operating4: 0o C to 70o C
− Non-Operating: -55o C to 95o C
- Reliability
— Uncorrectable Bit Error Rate (UBER): <1 sector per 1016 bits read
— Mean Time Between Failure (MTBF): 1,200,000 hours
— Shock (operating and non-operating): 1,000 G/0.5 msec
- Vibration
— Operating: 2.17 GRMS (5-700 Hz)
— Non-operating: 3.13 GRMS (5-800 Hz)
- Certifications and Declarations:
− UL*
− CE*
− C-Tick*
− BSMI*
− KCC*
− Microsoft* WHCK
− VCCI*
− SATA-IO*
- Product Ecological Compliance
− RoHS*
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NOTES:
- Performance values vary by capacity.
- Random 4 KB writes measured using out-of-box SSD
- Non-DevSleep idle power with SATA Link Power Management (LPM) enabled
- As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device operating temperatures on heavier workloads.
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PART NUMBER |
Photo |
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SSDMCEAW240A4 |
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Capacity
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Sequential Read/Write (up to)1 |
Random 4KB Read/Write (up to)2 |
Form Factor |
| 240GB |
6Gb/s 540 MB/s / 490 MB/s |
41,000 IOPS / 80,000 IOPS |
mSATA |
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Intel® Solid-State Drive 530 Series (mSATA)
Product Specification |
- Capacities: 240 GB
- Components:
− Intel® 20 nm NAND Flash Memory
− Multi-Level Cell (MLC)
- Form Factors: mSATA full size
- Thickness: up to 3.8 mm
- Weight: < 10 grams
- SATA 6 Gb/s Bandwidth Performance1
(Iometer* Queue Depth 32)
− Sustained Sequential Read: up to 540 MB/s
− Sustained Sequential Write: up to 490 MB/s
- Read and Write IOPS1
(Iometer Queue Depth 32)
− Random 4 KB Reads: up to 41,000 IOPS
− Random 4 KB Writes: up to 80,000 IOPS2
- Data Compression
- AES 256-bit Encryption
- End-to-End Data Protection
- Compatibility
− Intel® SSD Toolbox with Intel® SSD Optimizer
− Intel® Data Migration Software
− Intel® Rapid Storage Technology
− SATA Revision 3.0
− ACS-2 (ATA/ATAPI Command Set 2)
− SSD Enhanced SMART ATA feature set
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- Power Management
− 3.3 V SATA Supply Rail
− SATA Link Power Management (LPM)
− Device Sleep (DevSleep)
- Power
− Active (BAPCo MobileMark* 2007 Workload): 140 mW
− Idle3: 55 mW
− DevSleep: 200 μW
- Temperature
− Operating4: 0o C to 70o C
− Non-Operating: -55o C to 95o C
- Reliability
− Uncorrectable Bit Error Rate (UBER): <1 sector per 1016 bits read
− Mean Time Between Failure (MTBF): 1,200,000 hours
− Shock (operating and non-operating): 1,000 G/0.5 msec
- Vibration
− Operating: 2.17 GRMS (5-700 Hz)
− Non-operating: 3.13 GRMS (5-800 Hz)
- Certifications and Declarations:
− UL*
− CE*
− C-Tick*
− BSMI*
− KCC*
− Microsoft* WHCK (Windows* 7 and 8)
− VCCI*
− SATA-IO*
- Product Ecological Compliance
− RoHS*
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NOTES:
- Performance values vary by capacity.
- Random 4 KB writes measured using out-of-box SSD
- Non-DevSleep idle power with SATA Link Power Management (LPM) enabled
- As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device operating temperatures on heavier workloads.
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